3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
Book Details
Format
Hardback or Cased Book
Book Series
IEEE Press
ISBN-10
1119289645
ISBN-13
9781119289647
Publisher
John Wiley & Sons Inc
Imprint
Wiley-IEEE Press
Country of Manufacture
SG
Country of Publication
GB
Publication Date
Jun 19th, 2018
Print length
464 Pages
Weight
839 grams
Dimensions
23.90 x 16.80 x 2.80 cms
Product Classification:
Circuits & componentsComputer architecture & logic design
Ksh 20,850.00
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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detailProvides chapter-wise review questions and powerpoint slides as teaching tools
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