3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
2022 ed.
Book Details
Format
Hardback or Cased Book
ISBN-10
3030982289
ISBN-13
9783030982287
Edition
2022 ed.
Publisher
Springer Nature Switzerland AG
Imprint
Springer Nature Switzerland AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 28th, 2022
Print length
395 Pages
Product Classification:
Circuits & componentsEmbedded systemsComputer architecture & logic design
Ksh 19,800.00
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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
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