3D Microelectronic Packaging : From Architectures to Applications
Second Edition 2021
Book Details
Format
Paperback / Softback
Book Series
Springer Series in Advanced Microelectronics
ISBN-10
9811570922
ISBN-13
9789811570926
Edition
Second Edition 2021
Publisher
Springer Verlag, Singapore
Imprint
Springer Verlag, Singapore
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Nov 24th, 2021
Print length
622 Pages
Product Classification:
Materials scienceElectronics engineeringCircuits & componentsElectronic devices & materials
Ksh 27,000.00
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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
Get 3D Microelectronic Packaging by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer Verlag, Singapore and it has pages.
