Adhesion in Microelectronics
Book Details
Format
Hardback or Cased Book
ISBN-10
1118831330
ISBN-13
9781118831335
Publisher
John Wiley & Sons Inc
Imprint
Wiley-Scrivener
Country of Manufacture
US
Country of Publication
GB
Publication Date
Oct 24th, 2014
Print length
368 Pages
Weight
636 grams
Dimensions
24.40 x 16.30 x 2.50 cms
Product Classification:
Industrial chemistry and chemical engineeringChemical engineeringElectronics engineering
Ksh 33,100.00
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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings
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