Advanced Electronic Packaging 2e
Book Details
Format
Hardback or Cased Book
Book Series
IEEE Press Series on Microelectronic Systems
ISBN-10
0471466093
ISBN-13
9780471466093
Publisher
John Wiley & Sons Inc
Imprint
Wiley-IEEE Press
Country of Manufacture
US
Country of Publication
GB
Publication Date
May 23rd, 2006
Print length
848 Pages
Weight
1,728 grams
Dimensions
19.00 x 26.40 x 5.10 cms
Product Classification:
Electronics engineering
Ksh 29,700.00
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This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
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