Advanced Flip Chip Packaging
Book Details
Format
Hardback or Cased Book
ISBN-10
1441957677
ISBN-13
9781441957672
Publisher
Springer-Verlag New York Inc.
Imprint
Springer-Verlag New York Inc.
Country of Manufacture
US
Country of Publication
GB
Publication Date
Mar 21st, 2013
Print length
560 Pages
Weight
922 grams
Dimensions
24.30 x 16.20 x 2.60 cms
Ksh 32,400.00
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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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