Advanced Materials for Interconnections
by
Th. Gessner
Book Details
Format
Hardback or Cased Book
ISBN-10
0444205071
ISBN-13
9780444205070
Publisher
Elsevier Science & Technology
Imprint
Elsevier Science Ltd
Country of Manufacture
US
Country of Publication
GB
Publication Date
Dec 18th, 1997
Print length
460 Pages
Weight
1,130 grams
Product Classification:
Materials scienceCircuits & components
Ksh 37,800.00
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Contains chapter related to Metallization that discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. This book also covers Process Integration.
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