Advanced Microsystems for Automotive Applications Yearbook 2002
Book Details
Format
Hardback or Cased Book
Book Series
VDI-Buch / Chemische Technik / Verfahrenstechnik
ISBN-10
3540432329
ISBN-13
9783540432326
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint
Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Mar 1st, 2002
Print length
354 Pages
Weight
668 grams
Dimensions
24.40 x 16.30 x 2.70 cms
Ksh 12,950.00
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Microsystems are an important success factor in the automobile industry. With the international conference AMAA 2002, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacturers.
1 Microsystems for Automotive Applications: Markets and Perspectives.- 1.1 Markets and Opportunities for MEMS/MST in Automotive Applications.- 1.2 The Automotive Microsystems Market: Insights from the NEXUS Market Study 20012.- 1.3 Automotive Micro and Nano- Technology in the European Sixth Framework Programme.- 1.4 Regulations for Automotive Applications.- 2 Microsystems Technologies and Materials.- 2.1 Microsystems Technology - a New Era Leading to Unequalled Potentials for Automotive Applications.- 2.2 Fabrication Technologies for 3D-microsensor Structures.- 2.3 Signal Processing for Automotive Applications.- 2.4 Materials for Electronic Systems in Automotive Applications - Silicon On Insulator (SOI).- 2.5 Microsystems Packaging for Automotive Applications.- 2.6 Micro-Mechatronics in Automotive Applications.- 3 Functions and Applications.- 3.1 Towards Ambient Intelligence - Obstacle Detection.- 3.1.1 Overview: Obstacle Detection.- 3.1.2 Environment Sensing for Advanced Driver Assistance - CARSENSE.- 3.1.3 True 360° Sensing Using Multiple Systems.- 3.1.4 Electronic Scanning Antenna for Autonomous Cruise Control Applications.- 3.1.5 Advanced Uncooled Infrared System Electronics.- 3.1.6 Laserscanner for Obstacle Detection.- 3.1.7 Infrared Camera for cAR - ICAR a EURIMUS Project for Driver Vision Enhancement.- 3.1.8 Micro-Opto-Electro-Mechanical-Ssystems (MOEMS) in Automotive Applications.- 3.2 Powertrain Applications.- 3.2.1 Overview: Microsystems as a Key Eelement for Advanced Powertrain Systems.- 3.2.2 A Piezoelectric Driven Microinjector for Dl-Gasoline Applications.- 3.2.3 A Robust Hot Film Anemometer for Injection Quantity Measurements.- 3.2.4 Non-Contact Magnetostrictive Torque Sensor - Opportunities and Realisation.- 3.2.5 Benefits of a Cylinder Pressure Based Engine Management System on a Vehicle.- 3.3 Measurement - Angle and Position Sensors for Vehicles.- 3.3.1 TPO (True Power On) Active Camshaft Sensor for Low Emission Regulation.- 3.3.2 Contactless Position Sensors for Safety-critical Applications.- 3.3.3 High Resolution Absolute Angular Position Detection with Single Chip Capability.- 3.4 Measurement - Pressure Sensing in Automotive Applications.- 3.3.4 Programmable Linear Magnetic Hall-Effect Sensor with Excellent Accuracy.- 3.4.1 Overview: Principles and Technologies for Pressure Sensors for Automotive Applications.- 3.4.2 Tire Pressure Monitoring Systems - the New MEMS Based Safety Issue.- 3.4.3 Measurement of the Actuation Force of the Brake Pedal in Brake-by-wire Systems Via the Use of Micromechanical Sensors.- 3.4.4 Design of a New Concept Pressure Sensor for X-by-wire Automotive Applications.- 3.4.5 Pressure Sensors in the Pressure Range 0 - 300 bar for Oil Pressure Applications - Directly in the Oil Media.- 3.5 Further Functions and Applications.- 3.5.1 Sensors in the Next Generation Automotive Networks.- 3.5.2 Plastic Packaging for Various Sensor Applications in the Automotive Industry.- 3.5.3 Harsh Fluid Resistant Silicone Encapsulants for the Automotive Industry.- 3.5.4 Silicon-On-lnsulator (SOI) Solutions for Automotive Applications.- 3.5.5 Micromachined Gyroscope in Silicon-On-lnsulator (SOI) Technology.- 3.5.6 Thermal Microsensor for the Detection of Side-Impacts in Vehicles.- 3.5.7 Low-cost Filling-level Sensor.- 3.5.8 IBA - Integrated Bus Compatible Initiator.- Contributors.- Keywords.
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