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Analytical Models of Thermal Stresses in Composite Materials IV
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Analytical Models of Thermal Stresses in Composite Materials IV

Book Details

Format Hardback or Cased Book
ISBN-10 163463750X
ISBN-13 9781634637503
Publisher Nova Science Publishers Inc
Imprint Nova Science Publishers Inc
Country of Manufacture US
Country of Publication GB
Publication Date Jan 1st, 2015
Print length 215 Pages
Weight 538 grams
Dimensions 26.40 x 18.60 x 1.70 cms
Product Classification: Materials science
Ksh 43,900.00
Not available 0 in stock

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This book is the fourth volume in a series of books that present original results in the study of analytical models of thermal stresses in composite materials. Within the analytical modelling, two- and three-component composites are replaced by multi-particle-matrix and multi-particle-envelope-matrix systems, respectively, which consist of isotropic and/or anisotropic components represented by spherical particles (without or with an envelope of the particle surface) periodically distributed in an infinite matrix. In addition to the thermal stresses, analytical models of thermal-stress induced phenomena (crack formation, limit state, energy barrier, strengthening, lifetime prediction) are also discussed. Illustrative examples of applications of these analytical models are examined against real engineering materials (superconductive and structural ceramic composites). Results of this book are applicable within basic research (solid continuum mechanics, theoretical physics, materials science and engineering) as well as within engineering practices.

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