Analytical Models of Thermal Stresses in Composite Materials IV
Book Details
Format
Hardback or Cased Book
ISBN-10
163463750X
ISBN-13
9781634637503
Publisher
Nova Science Publishers Inc
Imprint
Nova Science Publishers Inc
Country of Manufacture
US
Country of Publication
GB
Publication Date
Jan 1st, 2015
Print length
215 Pages
Weight
538 grams
Dimensions
26.40 x 18.60 x 1.70 cms
Product Classification:
Materials science
Ksh 43,900.00
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This book is the fourth volume in a series of books that present original results in the study of analytical models of thermal stresses in composite materials. Within the analytical modelling, two- and three-component composites are replaced by multi-particle-matrix and multi-particle-envelope-matrix systems, respectively, which consist of isotropic and/or anisotropic components represented by spherical particles (without or with an envelope of the particle surface) periodically distributed in an infinite matrix. In addition to the thermal stresses, analytical models of thermal-stress induced phenomena (crack formation, limit state, energy barrier, strengthening, lifetime prediction) are also discussed. Illustrative examples of applications of these analytical models are examined against real engineering materials (superconductive and structural ceramic composites). Results of this book are applicable within basic research (solid continuum mechanics, theoretical physics, materials science and engineering) as well as within engineering practices.
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