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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

By: USA) Suhir Portland Ephraim (Portland State University (Author)

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Ksh 33,600.00

Format: Hardback or Cased Book

ISBN-13: 9781138624733

Publisher: Taylor & Francis Ltd

Publication Date: Jan 28th, 2021

Weight: 754 grams

Dimension: 16.70 x 24.10 x 3.10 cms

Category: ENVIRONMENTAL SCIENCE, ENGINEERING & TECHNOLOGY

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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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