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Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613

By: Rajiv K. (University of Florida) Singh (Author) , Rajeev Bajaj (Author) , Mansour Moinpour (Author)

Manufacture on Demand

Ksh 6,250.00

Format: Paperback or Softback

ISBN-13: 9781107413146

Publisher: Cambridge University Press

Publication Date: Jun 5th, 2014

Weight: 24 grams

Dimension: 22.90 x 15.20 x 1.00 cms

Category: INDUSTRIAL CHEMISTRY & MANUFACTURING TECHNOLOGIES

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Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.

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