Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613
Book Details
Format
Paperback / Softback
Book Series
MRS Proceedings
ISBN-10
1107413141
ISBN-13
9781107413146
Publisher
Cambridge University Press
Imprint
Cambridge University Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 5th, 2014
Print length
176 Pages
Weight
24 grams
Dimensions
22.90 x 15.20 x 1.00 cms
Product Classification:
Industrial chemistry & manufacturing technologiesMaterials science
Ksh 4,850.00
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Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.
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