Book Details
Format
Hardback or Cased Book
ISBN-10
9811999163
ISBN-13
9789811999161
Edition
2023 ed.
Publisher
Springer Verlag, Singapore
Imprint
Springer Verlag, Singapore
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Mar 28th, 2023
Print length
525 Pages
Weight
1,068 grams
Dimensions
16.20 x 24.20 x 3.30 cms
Product Classification:
Precision instruments manufactureCircuits & components
Ksh 28,800.00
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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Get Chiplet Design and Heterogeneous Integration Packaging by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer Verlag, Singapore and it has pages.
