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Competitive-cum-Cooperative Interfirm Relations and Dynamics in the Japanese Semiconductor Industry
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Competitive-cum-Cooperative Interfirm Relations and Dynamics in the Japanese Semiconductor Industry : Japanese Semiconductor Industry in Its Golden Age (1977-1992)

Book Details

Format Hardback or Cased Book
ISBN-10 4431702660
ISBN-13 9784431702665
Publisher Springer Verlag, Japan
Imprint Springer Verlag, Japan
Country of Manufacture GB
Country of Publication GB
Publication Date Oct 1st, 1999
Print length 256 Pages
Weight 518 grams
Dimensions 24.40 x 16.20 x 2.20 cms
Ksh 12,950.00
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The purpose of this text is to explain how interfirm relations contributed to their dynamics during the golden age of the semiconductor industry. It clarifies the real source of dynamics in interfirm relations and how the firms have interacted.
One Theory of Competitive-cum-cooperative (CCC) Interfirm Governance.- A. Theoretical Bases: Transaction Cost Economics and Path-dependent Institutional Development.- B. Harmonizing Mechanisms and Path-dependent Institutional Development.- 1. Roles of Institutions.- 2. Types of Intra- and Interfirm Interaction and Governance.- C. Institutions and Transformation of Cooperative Behavior.- 1. Traditional and Rigid Cooperation.- 2. Transformation to Flexible Cooperation.- D. Competitive-cum-cooperative Interfirm Relations.- 1. Cooperation-promoting and Competition-generating Measures.- 2. Flexible-synergy and Market-like Effects.- 3. Logic of Continuity.- 4. Power Relationships and Logic of Continuity.- 5. Cooperation- and Competition-oriented CCC Interaction (Influence of Market Conditions and Functions).- 6. Measures Generating Flexible-synergy and Market-like Effects.- E. Propositions for Empirical Inquiry.- Two.- A. Typology of Technological Innovativeness.- B. Development of the Transistor in Japan.- 1. Experimental Imitation Period (1948-1953).- 2. Imitation-for-production Period (1954-1959).- 3. Innovative Imitation Period (1960-1964).- C. Development of the Integrated Circuit (IC) and Other Semiconductors.- 1. Experimental Imitation Period (1958-1962).- 2. Market Uncertainty Period (1963-1964).- 3. Innovative Imitation Period (1965-1967).- 4. Application Engineering Period (1968).- D. Development of the Large-scale Integrated Circuit (LSI) and Other Semiconductors.- 1. Application Engineering Period with Market Uncertainty (1969-1971).- 2. Application Engineering Period (1972-1974).- 3. Development of the Very-large-scale Integrated Circuit (VLSI) and Other Semiconductors-Leveraged Creativity Period (1975-1983).- F. Development of Ultra-large-scale Integrated Circuit (ULSI) and Other Semiconductors-Leveraged Creativity Period (1984-1992).- Three Basic Characteristics of Intra- and Interfirm Interaction.- A. Prevalence of Competitive-cum-cooperative Interaction in Business Transactions.- B. Nature and Characteristics of Interaction.- 1. Procurement of Parts and Materials.- 2. Procurement of Manufacturing Equipment.- 3. Sales.- 4. R&D.- C. Summary.- Four Effects of Cooperation-oriented CCC Interaction in Procurement Relations.- A. Procurement of Parts and Materials.- 1. Flexible-synergy Effects.- 2. Market-like Effects.- 3. Summary: Dynamics of Cooperation-oriented CCC Interaction.- B. Procurement of Manufacturing Equipment.- 1. Flexible-synergy Effects.- 2. Market-like Effects.- 3. Summary: Cooperation-oriented CCC Interaction and Specialization.- C. Comparison of CCC Interaction in the Procurement of Parts/Materials and of Equipment.- Five Effects of Competition-oriented CCC Interaction in Sales and Internalized Interaction in R&D.- A. Sales.- 1. Market-like Effects.- 2. Flexible-synergy Effects.- 3. Summary: Tough Horizontally-related and Highly Cooperative Intrafirm Customers.- B. Dynamics of Intrafirm Relations in R&D.- C. Comparison of CCC Interaction in the Procurement of Parts/Materials and Sales.- Six CCC Dynamics and Structure of Intra- and Interfirm Relations.- A. Dynamic Mechanism of Competitive-cum-cooperative Interfirm Relations.- B. Overall Structure of Intra- and Interfirm Relations.- 1. Core Elements.- 2. Supportive Core Elements.- 3. Semi-peripheral Elements.- 4. Peripheral Elements 191Appendix.- Author Index.

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