Contactless VLSI Measurement and Testing Techniques
Softcover reprint of the original 1st ed. 2018
Book Details
Format
Paperback / Softback
ISBN-10
3319888196
ISBN-13
9783319888194
Edition
Softcover reprint of the original 1st ed. 2018
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Sep 4th, 2018
Print length
93 Pages
Ksh 16,200.00
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The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing.
This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test.
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