Design And Modeling For 3d Ics And Interposers
Book Details
Format
Hardback or Cased Book
ISBN-10
9814508594
ISBN-13
9789814508599
Publisher
World Scientific Publishing Co Pte Ltd
Imprint
World Scientific Publishing Co Pte Ltd
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Dec 24th, 2013
Print length
380 Pages
Weight
672 grams
Dimensions
15.60 x 23.60 x 2.60 cms
Product Classification:
Electronic devices and materialsSemi-conductors & super-conductors
Ksh 21,600.00
Temporarily out of stock, due soon
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Get Design And Modeling For 3d Ics And Interposers by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by World Scientific Publishing Co Pte Ltd and it has pages.
