Die-stacking Architecture
Book Details
Format
Paperback / Softback
Book Series
Synthesis Lectures on Computer Architecture
ISBN-10
3031006194
ISBN-13
9783031006197
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 10th, 2015
Print length
113 Pages
Product Classification:
Circuits & componentsComputer architecture & logic design
Ksh 6,300.00
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The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
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