Direct Copper Interconnection for Advanced Semiconductor Technology
Book Details
Format
Hardback or Cased Book
ISBN-10
1032528230
ISBN-13
9781032528236
Publisher
Taylor & Francis Ltd
Imprint
CRC Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 28th, 2024
Print length
448 Pages
Weight
836 grams
Dimensions
16.30 x 24.30 x 3.30 cms
Product Classification:
Production & quality control managementProduction and quality control managementPurchasing & supply managementPurchasing and supply managementMedia, entertainment, information and communication industriesMedia, information & communication industriesEngineering: generalMechanical engineeringMaterials scienceElectrical engineeringElectronic devices & materialsElectronic devices and materialsAutomatic control engineeringEnvironmental science, engineering & technologyEnvironmental science, engineering and technology
Ksh 33,850.00
Temporarily out of stock, due soon
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
Get Direct Copper Interconnection for Advanced Semiconductor Technology by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Ltd and it has pages.
