Direct Copper Interconnection for Advanced Semiconductor Technology
Book Details
Format
Paperback / Softback
ISBN-10
1032528400
ISBN-13
9781032528403
Publisher
Taylor & Francis Ltd
Imprint
CRC Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
May 21st, 2026
Print length
448 Pages
Weight
850 grams
Product Classification:
Production & quality control managementProduction and quality control managementPurchasing & supply managementPurchasing and supply managementMedia, entertainment, information and communication industriesMedia, information & communication industriesEngineering: generalMechanical engineeringMaterials scienceElectrical engineeringElectronic devices & materialsElectronic devices and materialsAutomatic control engineeringEnvironmental science, engineering & technologyEnvironmental science, engineering and technology
Ksh 15,650.00
Werezi Extended Catalogue
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
Get Direct Copper Interconnection for Advanced Semiconductor Technology by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Ltd and it has pages.
