Electrical Modeling and Design for 3D System Integration : 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
by
Er-Ping Li
Book Details
Format
Hardback or Cased Book
ISBN-10
0470623462
ISBN-13
9780470623466
Publisher
John Wiley & Sons Inc
Imprint
Wiley-IEEE Press
Country of Manufacture
US
Country of Publication
GB
Publication Date
Apr 19th, 2012
Print length
384 Pages
Weight
774 grams
Dimensions
24.10 x 15.60 x 1.80 cms
Product Classification:
Mathematical modellingElectronics engineering
Ksh 19,800.00
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The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.
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