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Electromigration Modeling at Circuit Layout Level
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Electromigration Modeling at Circuit Layout Level

2013 ed.

Book Details

Format Paperback / softback
ISBN-10 9814451207
ISBN-13 9789814451208
Edition 2013 ed.
Publisher Springer Verlag, Singapore
Imprint Springer Verlag, Singapore
Country of Manufacture SG
Country of Publication GB
Publication Date May 4th, 2013
Print length 103 Pages
KSh 8,100.00
Currently unavailable 0 in stock

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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Get Electromigration Modeling at Circuit Layout Level by Cher Ming Tan, Feifei He at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer Verlag, Singapore and it has 103 pages.

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