Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Book Details
Format
Hardback or Cased Book
Book Series
Springer Series in Reliability Engineering
ISBN-10
3031947940
ISBN-13
9783031947940
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jul 22nd, 2025
Print length
178 Pages
Ksh 25,200.00
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This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
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