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Electronic Packaging Materials and Their Properties

By: USA) Pecht College Park USA University of Maryland College Park Michael (University of Maryland (Author) , USA) Agarwal Indiana Kokomo Rakish (DE Corp (Author) , F. Patrick McCluskey (Author)

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Ksh 36,000.00

Format: Hardback or Cased Book

ISBN-13: 9780849396250

Publisher: Taylor & Francis Inc

Publication Date: Dec 18th, 1998

Dimension: 23.40 x 15.60 x 35.40 cms

Category: ELECTRONICS & COMMUNICATIONS ENGINEERING

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Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

Get Electronic Packaging Materials and Their Properties by Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Taylor & Francis Inc and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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