Search

Categories

    • categories-img Jacket, Women
    • categories-img Woolend Jacket
    • categories-img Western denim
    • categories-img Mini Dresss
    • categories-img Jacket, Women
    • categories-img Woolend Jacket
    • categories-img Western denim
    • categories-img Mini Dresss
    • categories-img Jacket, Women
    • categories-img Woolend Jacket
    • categories-img Western denim
    • categories-img Mini Dresss
    • categories-img Jacket, Women
    • categories-img Woolend Jacket
    • categories-img Western denim
    • categories-img Mini Dresss
    • categories-img Jacket, Women
    • categories-img Woolend Jacket
    • categories-img Western denim
    • categories-img Mini Dresss

Filter By Price

$
-
$

Dietary Needs

Top Rated Product

product-img product-img

Modern Chair

$165.00
product-img product-img

Plastic Chair

$165.00
product-img product-img

Design Rooms

$165.00

Brands

  • Wooden
  • Chair
  • Modern
  • Fabric
  • Shoulder
  • Winter
  • Accessories
  • Dress

Welcome and thank you for visiting us. For any query call us on 0799 626 359 or Email [email protected]

Shopping Cart

Africa largest book store

Sub Total:

Search for any Title

Electronic Packaging Materials and Their Properties

By: USA) Pecht College Park USA University of Maryland College Park Michael (University of Maryland (Author) , USA) Agarwal Indiana Kokomo Rakish (DE Corp (Author) , F. Patrick McCluskey (Author)

Manufacture on Demand

Ksh 36,000.00

Format: Hardback or Cased Book

ISBN-13: 9780849396250

Publisher: Taylor & Francis Inc

Publication Date: Dec 18th, 1998

Dimension: 23.40 x 15.60 x 35.40 cms

Category: ELECTRONICS & COMMUNICATIONS ENGINEERING

Choose your Location

Shipping & Delivery

Door Delivery

Delivery fee

Delivery by 24 January when you order within the next 0 days 15 hours 46 minutes 16 seconds

  • Description

  • Reviews

Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

Get Electronic Packaging Materials and Their Properties by Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Taylor & Francis Inc and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

Customer Reviews

Based on 0 reviews

Mind, Body, & Spirit