Electronics Cooling: From the Chip to the Datacenter

Name: Electronics Cooling: From the Chip to the Datacenter
Brand: Elsevier Science Publishing Co Inc
SKU: 9780443470844
Price: 28550 KES
Availability: OutOfStock
ISBN: 9780443470844

Book Details

Format Hardback

Book Series Advances in Heat Transfer

ISBN-10 0443470847

ISBN-13 9780443470844

Publisher Elsevier Science Publishing Co Inc

Imprint Academic Press Inc

Country of Manufacture GB

Country of Publication GB

Publication Date Nov 1st, 2026

Print length 300 Pages

Weight 450 grams

Product Classification: Thermodynamics & heat Thermodynamics and heat Mechanical engineering

KSh 28,550.00

Not Yet Published 0 in stock

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Electronics Cooling: From the Chip to the Datacenter, Volume 62 provides a concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.

Get Electronics Cooling: From the Chip to the Datacenter at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Elsevier Science Publishing Co Inc and it has 300 pages.