Electronics Cooling: From the Chip to the Datacenter
Book Details
Format
Hardback or Cased Book
Book Series
Advances in Heat Transfer
ISBN-10
0443470847
ISBN-13
9780443470844
Publisher
Elsevier Science Publishing Co Inc
Imprint
Academic Press Inc
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Nov 1st, 2026
Print length
300 Pages
Weight
450 grams
Product Classification:
Thermodynamics & heatThermodynamics and heatMechanical engineering
Ksh 28,550.00
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Electronics Cooling: From the Chip to the Datacenter, Volume 62 provides a concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.
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