From Images and Technical Drawings to 3D Models: A Novel Approach to As-Built Reconstruction
Book Details
Format
Paperback / Softback
ISBN-10
3898215172
ISBN-13
9783898215176
Publisher
ibidem-Verlag, Jessica Haunschild u Christian Schon
Imprint
ibidem-Verlag, Jessica Haunschild u Christian Scho
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 27th, 2005
Print length
182 Pages
Weight
267 grams
Product Classification:
Electronics & communications engineeringElectronics and communications engineering
Ksh 3,600.00
Werezi Extended Catalogue
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
Marker-based photogrammetric as-built reconstruction is a well established method to capture industrial sites. However, to reduce costs and to accelerate the reconstruction procedure, there is an increasing demand for marker-free reconstruction methods. Aiming to eliminate the need for markers, we present a novel approach to as-built reconstruction, which integrates technical drawings as orthographic images seamlessly into the photogrammetric reconstruction process. We introduce a new type of image, the so called co-registered orthographic and perspective (COP) image, which consists of an orthographic view integrated into a perspective view. Metric measurements and reconstruction are possible using only a single COP image. We discuss epipolar geometry for this type of image and we provide orientation and reconstruction methods custom tailored to COP images for points, lines, and cylindric objects. Multiple examples of application in industrial environment show the practical applicability of the presented methods and confirm that the requirements for accuracy in typical applications can well be met.
Get From Images and Technical Drawings to 3D Models: A Novel Approach to As-Built Reconstruction by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by ibidem-Verlag, Jessica Haunschild u Christian Schon and it has pages.