Fundamentals of Lead-Free Solder Interconnect Technology : From Microstructures to Reliability
Softcover reprint of the original 1st ed. 2015
Book Details
Format
Paperback / Softback
ISBN-10
1489978011
ISBN-13
9781489978011
Edition
Softcover reprint of the original 1st ed. 2015
Publisher
Springer-Verlag New York Inc.
Imprint
Springer-Verlag New York Inc.
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Oct 1st, 2016
Print length
253 Pages
Ksh 16,200.00
Publisher Out of Stock
0 in stock
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Quality
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Get Fundamentals of Lead-Free Solder Interconnect Technology by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer-Verlag New York Inc. and it has pages.
