Guidebook for Managing Silicon Chip Reliability
Book Details
Format
Hardback
ISBN-10
0849396247
ISBN-13
9780849396243
Publisher
Taylor & Francis Inc
Imprint
CRC Press Inc
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Dec 29th, 1998
Print length
224 Pages
Weight
489 grams
Product Classification:
Electronic devices & materialsElectronic devices and materials
KSh 22,500.00
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Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?
Chapters discuss:
failure sites, operational loads, and failure mechanism
intrinsic device sensitivities
electromigration
hot carrier aging
time dependent dielectric breakdown
mechanical stress induced migration
alpha particle sensitivity
electrostatic discharge (ESD) and electrical overstress
latch-up
qualification
screening
guidelines for designing reliability
Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?
Chapters discuss:
Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Get Guidebook for Managing Silicon Chip Reliability by Gopal Rao, Michael Pecht at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Inc and it has 224 pages.
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