Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Book Details
Format
Hardback or Cased Book
Book Series
Mechanical Engineering
ISBN-10
0824748700
ISBN-13
9780824748708
Publisher
Taylor & Francis Inc
Imprint
CRC Press Inc
Country of Manufacture
US
Country of Publication
GB
Publication Date
Feb 27th, 2004
Print length
1044 Pages
Weight
2,140 grams
Dimensions
18.10 x 26.10 x 6.40 cms
Ksh 75,600.00
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Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Get Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Inc and it has pages.
