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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

By: USA) Puttlitz New York East Fishkill Karl J. (IBM (Author) , USA) Stalter New York Fishkill Kathleen A. (IBM (Author) , USA) Faulkner Ohio Columbus Lynn (Battelle (Author)

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Ksh 84,000.00

Format: Hardback or Cased Book

ISBN-13: 9780824748708

Publisher: Taylor & Francis Inc

Publication Date: Feb 27th, 2004

Weight: 2140 grams

Dimension: 18.10 x 26.10 x 6.40 cms

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Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.

Get Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. (IBM, East Fishkill, New York, USA) Puttlitz at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Taylor & Francis Inc and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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