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Handbook of Semiconductor Manufacturing Technology
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Handbook of Semiconductor Manufacturing Technology

Book Details

Format Hardback or Cased Book
ISBN-10 1574446754
ISBN-13 9781574446753
Publisher Taylor & Francis Inc
Imprint CRC Press Inc
Country of Manufacture US
Country of Publication GB
Publication Date Jul 9th, 2007
Print length 1720 Pages
Weight 1,972 grams
Dimensions 25.70 x 18.60 x 6.90 cms
Product Classification: Semi-conductors & super-conductors
Ksh 42,300.00
Re-Printing 0 in stock

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A guide to the individual processes, equipment, and materials of semiconductor manufacturing technologies. It features chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, and damascene copper electroplating.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition''s place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today''s most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world''s leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.

Stay Current with the Latest Technologies
In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on…
  • Silicon-on-insulator (SOI) materials and devices
  • Supercritical CO2 in semiconductor cleaning
  • Low-? dielectrics
  • Atomic-layer deposition
  • Damascene copper electroplating
  • Effects of terrestrial radiation on integrated circuits (ICs)

    Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication.

    While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

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