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Heat Transfer
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Heat Transfer : Thermal Management of Electronics

Book Details

Format Hardback or Cased Book
ISBN-10 1439814678
ISBN-13 9781439814673
Publisher Taylor & Francis Inc
Imprint CRC Press Inc
Country of Manufacture US
Country of Publication GB
Publication Date Dec 17th, 2009
Print length 524 Pages
Weight 886 grams
Dimensions 24.60 x 15.50 x 2.90 cms
Ksh 26,300.00
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Covers the basic knowledge necessary to understand and solve simple electronic cooling problems. This book explores details on heat transfer fundamentals to give the reader an understanding of associated physics. It describes the experimental and numerical techniques and tools used in a typical thermal design process.

The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.

Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase.

The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods.

With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.


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