Integrated Wireless Power, Data Communication, and Thermal Sensing Systems for Autonomous Multisite Brain Implants
Book Details
Format
Hardback or Cased Book
ISBN-10
3031908384
ISBN-13
9783031908385
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jul 22nd, 2025
Print length
156 Pages
Weight
480 grams
Dimensions
17.30 x 24.70 x 1.50 cms
Ksh 8,100.00
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This book provides professionals in microelectronic implantable bio-medical systems an overview of recent techniques in wireless power and data telemetry.
This book provides professionals in microelectronic implantable bio-medical systems an overview of recent techniques in wireless power and data telemetry. State-of-the-art techniques are overviewed and original methods presented. The book features an up-to-date overview of CMOS wireless telemetry microelectronics for cortical implants. The book gathers all layers of microelectronics wireless power and data transmission for cortical implants, discusses them in a critical manner and proposes solutions, i.e., at circuit and systems and system levels. This book compiles relevant information into a coherent presentation of the technical issues, proposed solutions and their compared efficiency, and details the authors’ original approaches. Professionals of microelectronics will find useful and accessible descriptions of the major issues and solutions to wireless telemetry. Researchers and professionals in bio-medical implantable systems will find fully justified novel methods in power and data telemetry and implantable systems telemetry architectures.
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