Interconnect Reliability in Advanced Memory Device Packaging
2023 ed.
Book Details
Format
Hardback or Cased Book
Book Series
Springer Series in Reliability Engineering
ISBN-10
3031267079
ISBN-13
9783031267079
Edition
2023 ed.
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Apr 29th, 2023
Print length
210 Pages
Product Classification:
Circuits & componentsComputer hardware
Ksh 32,400.00
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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.
Get Interconnect Reliability in Advanced Memory Device Packaging by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer International Publishing AG and it has pages.
