Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Softcover reprint of the original 1st ed. 2016
by
Qingke Zhang
Book Details
Format
Paperback / Softback
Book Series
Springer Theses
ISBN-10
3662517256
ISBN-13
9783662517253
Edition
Softcover reprint of the original 1st ed. 2016
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint
Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Country of Manufacture
DE
Country of Publication
GB
Publication Date
Aug 23rd, 2016
Print length
143 Pages
Ksh 8,100.00
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This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions. The fracture behavior of Pb-free joint interfaces inducedby stress, deformation of solder and substrate are shown, the shear fracturestrength of the Cu6Sn5 IMC is measured experimentally for the first time, andthe dynamic damage process and microstructure evolution behavior of Pb-freesolder joints are revealed intuitively. The thesis puts forward the argumentthat the local cumulative damage is the major cause of failure in solderjoints. The research results provide the experimental and theoretical basis forimproving the reliability of solder joints.
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