ISTFA 2021 : Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
Book Details
Format
Paperback / Softback
ISBN-10
1627084193
ISBN-13
9781627084192
Publisher
A S M International
Imprint
A S M International
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jul 30th, 2022
Print length
461 Pages
Weight
1,150 grams
Dimensions
23.10 x 28.60 x 3.10 cms
Product Classification:
Testing of materials
Ksh 31,150.00
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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
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