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Lead-Free Solder Process Development
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Lead-Free Solder Process Development

Book Details

Format Hardback or Cased Book
ISBN-10 0470410744
ISBN-13 9780470410745
Publisher John Wiley & Sons Inc
Imprint Wiley-IEEE Press
Country of Manufacture SG
Country of Publication GB
Publication Date Mar 1st, 2011
Print length 284 Pages
Weight 572 grams
Dimensions 21.30 x 16.10 x 2.20 cms
Ksh 19,050.00
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This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability.

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