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Materials for Advanced Packaging
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Materials for Advanced Packaging

2nd ed. 2017

Book Details

Format Hardback or Cased Book
ISBN-10 3319450972
ISBN-13 9783319450971
Edition 2nd ed. 2017
Publisher Springer International Publishing AG
Imprint Springer International Publishing AG
Country of Manufacture CH
Country of Publication GB
Publication Date Dec 30th, 2016
Print length 969 Pages
Product Classification: Metals technology / metallurgyPrecision instruments manufactureMetals technology / metallurgyPrecision engineering and manufacturingCircuits & componentsElectronics: circuits and componentsElectronic devices & materialsElectronic devices and materials
Ksh 45,000.00
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Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Get Materials for Advanced Packaging by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer International Publishing AG and it has pages.

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