Materials for High-Density Electronic Packaging and Interconnection
Book Details
Format
Paperback / Softback
ISBN-10
030904233X
ISBN-13
9780309042338
Publisher
National Academies Press
Imprint
National Academies Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jan 1st, 1990
Print length
156 Pages
Weight
301 grams
Dimensions
27.90 x 21.60 x 2.50 cms
Product Classification:
Materials scienceElectronics engineering
Ksh 27,000.00
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