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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition
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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition

Book Details

Format Hardback or Cased Book
ISBN-10 0071821015
ISBN-13 9780071821018
Publisher McGraw-Hill Education - Europe
Imprint McGraw-Hill Professional
Country of Manufacture US
Country of Publication GB
Publication Date Nov 16th, 2013
Print length 576 Pages
Weight 1,250 grams
Dimensions 19.90 x 24.60 x 3.60 cms
Product Classification: Microprocessors
Ksh 26,650.00
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Fully revised to cover the latest advances in the field, this new edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. Detailed illustrations and real-world examples are included.

Publisher''s Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.



The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

  • The semiconductor industry
  • Properties of semiconductor materials and chemicals
  • Crystal growth and silicon wafer preparation
  • Wafer fabrication and packaging
  • Contamination control
  • Productivity and process yields
  • Oxidation
  • The ten-step patterning process--surface preparation to exposure; developing to final inspection
  • Next generation lithography
  • Doping
  • Layer deposition
  • Metallization
  • Process and device evaluation
  • The business of wafer fabrication
  • Devices and integrated circuit formation
  • Integrated circuits
  • Packaging


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