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Microelectronic Interconnections and Assembly
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Microelectronic Interconnections and Assembly : Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996

Book Details

Format Hardback
ISBN-10 0792351398
ISBN-13 9780792351399
Publisher Kluwer Academic Publishers
Imprint Kluwer Academic Publishers
Country of Manufacture GB
Country of Publication GB
Publication Date Aug 31st, 1998
Print length 314 Pages
Weight 598 grams
Dimensions 24.40 x 16.20 x 2.20 cms
KSh 12,950.00
Currently unavailable 0 in stock

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This text covers the proceedings of the 1996 NATO Advanced Research Workshop which is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas.
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.

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