Book Details
Format
Hardback or Cased Book
ISBN-10
1608076970
ISBN-13
9781608076970
Edition
Unabridged
Publisher
Artech House Publishers
Imprint
Artech House Publishers
Country of Manufacture
US
Country of Publication
GB
Publication Date
Dec 31st, 2013
Print length
280 Pages
Weight
586 grams
Dimensions
23.50 x 15.90 x 2.20 cms
Product Classification:
Electronics engineering
Ksh 15,100.00
Manufactured on Demand
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Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.
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