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Modeling and Simulation for Microelectronic Packaging Assembly

By: China) Liu Hubei Wuhan Shen (Huazhong University of Science and Technology (Author) , Yong Liu (Author)

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Ksh 25,400.00

Format: Hardback or Cased Book

ISBN-13: 9780470827802

Publisher: John Wiley & Sons Inc

Publication Date: Oct 21st, 2011

Weight: 1134 grams

Dimension: 25.20 x 17.50 x 3.60 cms

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An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Get Modeling and Simulation for Microelectronic Packaging Assembly by Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China) Liu at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by John Wiley & Sons Inc and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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