Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing
Book Details
Format
Hardback or Cased Book
ISBN-10
0470827807
ISBN-13
9780470827802
Publisher
John Wiley & Sons Inc
Imprint
John Wiley & Sons Inc
Country of Manufacture
SG
Country of Publication
GB
Publication Date
Oct 21st, 2011
Print length
576 Pages
Weight
1,134 grams
Dimensions
25.20 x 17.50 x 3.60 cms
Product Classification:
Production engineeringElectronics engineering
Ksh 19,800.00
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An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Get Modeling and Simulation for Microelectronic Packaging Assembly by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by John Wiley & Sons Inc and it has pages.
