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Modeling of Adhesively Bonded Joints
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Modeling of Adhesively Bonded Joints

2008 ed.

Book Details

Format Hardback or Cased Book
ISBN-10 3540790551
ISBN-13 9783540790556
Edition 2008 ed.
Publisher Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Country of Manufacture GB
Country of Publication GB
Publication Date Jun 14th, 2008
Print length 335 Pages
Ksh 23,400.00
Werezi Extended Catalogue 0 in stock

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The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.

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