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Physical Design for 3D Integrated Circuits
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Physical Design for 3D Integrated Circuits

Book Details

Format Hardback or Cased Book
ISBN-10 1498710360
ISBN-13 9781498710367
Publisher Taylor & Francis Inc
Imprint CRC Press Inc
Country of Manufacture US
Country of Publication GB
Publication Date Dec 18th, 2015
Print length 397 Pages
Weight 914 grams
Dimensions 26.30 x 18.50 x 2.70 cms
Product Classification: Circuits & components
Ksh 31,500.00
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This book reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. Featuring contributions from renowned experts in their respective fields, this comprehensive reference provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

  • Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
  • Supplies state-of-the-art solutions for challenges unique to 3D circuit design
  • Features contributions from renowned experts in their respective fields

Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.


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