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Placement and Routing of Electronic Modules

By: (Edited by) Michael Pecht

Werezi Extended Catalogue
Delivery in 34 days

Ksh 48,600.00

Format: Hardback or Cased Book

ISBN-10: 0824789164

ISBN-13: 9780824789169

Series: Electrical and Computer Engineering

Publisher: Taylor & Francis Inc

Imprint: CRC Press Inc

Country of Manufacture: GB

Country of Publication: GB

Publication Date: Mar 12th, 1993

Print length: 352 Pages

Weight: 635 grams

Product Classification: Circuits & components

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Presents and compares the fundamental theories and techniques of placement and routing and provides approaches to solving specific problems. Focusing on reliable methods for good manufacturing capability, this work discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories.
This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

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