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Planar Processing Primer
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Planar Processing Primer

Softcover reprint of the original 1st ed. 1990

Book Details

Format Paperback / Softback
ISBN-10 9401066825
ISBN-13 9789401066822
Edition Softcover reprint of the original 1st ed. 1990
Publisher Springer
Imprint Springer
Country of Manufacture NL
Country of Publication GB
Publication Date Oct 28th, 2011
Print length 634 Pages
Product Classification: Interdisciplinary studies
Ksh 16,200.00
Werezi Extended Catalogue 0 in stock

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Planar Processing Primer is based on lecture notes for a silicon planar process­ ing lecture/lab course offered at the University of Illinois-UC for over fifteen years. The text describes and explains, at an introductory level, the principal processing steps used to convert raw silicon into a semiconductor device or integrated circuit.
Planar Processing Primer is based on lecture notes for a silicon planar process­ ing lecture/lab course offered at the University of Illinois-UC for over fifteen years. Directed primarily to electrical engineering upperclassmen and graduate students, the material also has been used successfully by graduate students in physics and ceramic and metallurgical engineering. It is suitable for self-study by engineers trained in other disciplines who are beginning work in the semiconductor fields, and it can make circuit design engineers aware of the processing limitations under which they must work. The text describes and explains, at an introductory level, the principal processing steps used to convert raw silicon into a semiconductor device or integrated circuit. First-order models are used for theoretical treatments (e.g., of diffusion and ion implantation), with reference made to more advanced treatments, to computer programs such as SUPREM that include higher order effects, and to interactions among sequential processes. In Chapters 8, 9, and to, the application of silicon processes to compound semiconductors is discussed briefly. Over the past several years, the size of transistors has decreased markedly, allowing more transistors per chip unit area, and chip size has increased.

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