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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

By: Yue Ma (Author) , Christian Gontrand (Author)

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Ksh 27,600.00

Format: Hardback or Cased Book

ISBN-13: 9780367023430

Publisher: Taylor & Francis Ltd

Publication Date: Mar 28th, 2019

Weight: 506 grams

Dimension: 16.40 x 24.10 x 1.60 cms

Category: Circuits & components

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New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Get Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by Yue Ma at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Taylor & Francis Ltd and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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