Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
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Get Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019) by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by American Society of Mechanical Engineers,U.S. and it has pages.