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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Book Details

Format Paperback / Softback
ISBN-10 0791859320
ISBN-13 9780791859322
Publisher American Society of Mechanical Engineers,U.S.
Imprint American Society of Mechanical Engineers,U.S.
Country of Manufacture US
Country of Publication GB
Publication Date Jun 30th, 2020
Print length 836 Pages
Weight 1,884 grams
Dimensions 21.50 x 27.90 x 4.80 cms
Product Classification: Mechanical engineering
Ksh 47,350.00
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