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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Softcover reprint of the original 1st ed. 2018

by Jie Cheng

Book Details

Format Paperback / Softback
ISBN-10 9811355851
ISBN-13 9789811355851
Edition Softcover reprint of the original 1st ed. 2018
Publisher Springer Verlag, Singapore
Imprint Springer Verlag, Singapore
Country of Manufacture GB
Country of Publication GB
Publication Date Jan 30th, 2019
Print length 137 Pages
Product Classification: Surface-coating technology Tribology (friction & lubrication) Materials science Production engineering Electronics engineering
Ksh 16,200.00 Werezi Extended Catalogue

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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.

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