Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 : Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics
2020 ed.
Book Details
Format
Paperback / Softback
ISBN-10
3030301001
ISBN-13
9783030301002
Edition
2020 ed.
Publisher
Springer Nature Switzerland AG
Imprint
Springer Nature Switzerland AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Aug 26th, 2021
Print length
169 Pages
Ksh 23,400.00
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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering.
Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:Test Design and Inverse Method AlgorithmsInverse Problems: Virtual Fields MethodResidual Stresses: Measurement, Uncertainty & ValidationResidual Stresses: Eigenvalues, Modeling, & Crack GrowthMaterial Characterizations Using ThermographyFatigue, Damage & Fracture Evaluation Using Infrared Thermography
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