Silicon Micromachining
Book Details
Format
Paperback / Softback
ISBN-10
0521607671
ISBN-13
9780521607674
Publisher
Cambridge University Press
Imprint
Cambridge University Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Aug 19th, 2004
Print length
420 Pages
Weight
808 grams
Dimensions
18.80 x 24.70 x 2.70 cms
Product Classification:
Electronic devices & materialsElectronic devices and materials
Ksh 12,950.00
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This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. It is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).
This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. Recent advances in these techniques have made it possible to create a new generation of microsystem devices, such as microsensors, accelerometers, micropumps, and miniature robots. The authors underpin the discussion of each technique with a brief review of the fundamental physical and chemical principles involved. They pay particular attention to methods such as isotropic and anisotropic wet chemical etching, wafer bonding, reactive ion etching, and surface micromachining. There is a special section on bulk micromachining, and the authors also discuss release mechanisms for movable microstructures. The book is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).
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