Stress and Strain Engineering at Nanoscale in Semiconductor Devices
Book Details
Format
Paperback / Softback
ISBN-10
036751933X
ISBN-13
9780367519339
Publisher
Taylor & Francis Ltd
Imprint
CRC Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Sep 25th, 2023
Print length
260 Pages
Weight
220 grams
Product Classification:
NanotechnologyElectronics engineeringCircuits & componentsElectronics: circuits and components
Ksh 11,700.00
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Based on 3D process and device simulations with mechanical stress simulations by finite element techniques, this book explains performance assessment of nanoscale devices with strained SiGe and other stressors. It explains the process-induced stress transfer and developments at 7nm technology and below node in the area of strain-engineered devices.
Based on 3D process and device simulations with mechanical stress simulations by finite element techniques, this book explains performance assessment of nanoscale devices with strained SiGe and other stressors. It explains the process-induced stress transfer and developments at 7nm technology and below node in the area of strain-engineered devices.
Get Stress and Strain Engineering at Nanoscale in Semiconductor Devices by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Ltd and it has pages.
